Description
The BZ17 Exynos 8895 & MSM8998 CPU Stencil is a high-precision BGA reballing Stencil
- Product Type: BGA IC reballing Android Stencil
- Description: A high-precision BGA reballing tool designed for professional Samsung mobile repairs.
- Compatibility: Engineered specifically for Exynos 8895 and MSM8998 processors.
- Compatible Devices:
- Samsung Galaxy S8 / S8+ (G9500, G955U)
- Samsung Galaxy Note 8 (N9500)
- Key Features: Durable steel construction ensures accurate solder paste application and perfect IC alignment. Essential for advanced CPU reballing and motherboard maintenance.
