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BZ 23 Qualcomm Snapdragon Exynos9810 S9/S9+

Original price was: ₨ 1,200.Current price is: ₨ 800.

BZ 23 Qualcomm Snapdragon Exynos9810 S9/S9+

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Description

  • Product Type: BGA IC reballing Android Stencil
  • Description: A professional-grade BGA reballing tool designed for high-precision mobile repairs. It is specifically engineered for Qualcomm Snapdragon 845 and Samsung Exynos 9810 processors.
  • Compatibility:
    • Devices: Samsung Galaxy S9 and S9+ series.
  • Key Features: Durable steel construction, ensures accurate solder paste application and perfect IC alignment. Essential for technicians performing advanced CPU reballing and motherboard maintenance.

Additional information

Weight0.1 kg