Description
JTX T4 Max Universal Chips Glue Removal and Tin Planting Platform Set
**Product Overview**
The JTX T4 Max is a professional-grade 2-in-1 maintenance platform designed for high-efficiency chip degumming (glue removal) and tin planting (reballing). As part of the Universal Chips Glue Removal tool range, it features a magnetic automatic clamping system and precise 3D positioning to ensure stable operation without damaging sensitive chips.
**Key Features**
- Magnetic Dynamic Positioning: Utilizes strong magnetic clamping for automatic alignment and stable operation.
- 2-in-1 Design: Combines glue removal and tin planting in one platform to save costs and improve workflow efficiency.
- High-Quality Construction: Made from high-toughness steel with wear-resistant, anti-slip, and high-temperature resistant properties. With these materials, the JTX Universal Chips Glue Removal platform ensures lasting reliability.
**Specifications**
- Supported Brands: Apple, Samsung, Huawei (Hisilicon), Qualcomm, MTK Dimensity, and Android RAM.
- Chip Support: Includes support for Apple A8 through A19 Pro, Qualcomm Snapdragon (up to SM8850), and MTK Dimensity (up to 9300).
- Material: Fine-finish high-quality steel. For more detail on Universal Chips Glue Removal specifications, see below.
**Supported Model **
- Apple: A8, A9, A10, A11, A12, A13, A14, A15, A16, A17, A18/Pro, A19/Pro.
- Qualcomm Extensive range including SM8450, SM8550, SM8650, and SM8750. Notably, all these chips are compatible with Universal Chips Glue Removal capabilities.
- MTK Dimensity: 1100, 1200, 9200, 9300, and more.
- Samsung Exynos: 990, 2100, 2200, 9820, etc.
- Huawei Hisilicon: HI3660, HI3690 (5G/4G), HI36A0, and others.
- Total supoorted Chip: 102
**Package Includes**
- 1 x Precision Fixture
- 17 x Specialized Stencils
- High-Temperature Resistant CPU Reballing Glass
You can find this product at World Gsm Telecom . For ordering, remember the model: JTX T4 Max Universal Chips Glue Removal kit.
