Description
The BZ03 MSM8916 Stencil is a professional BGA reballing Stencil
- Product Type: BGA IC reballing Android Stencil
- Description: A professional BGA reballing tool designed for high-precision repairs on Huawei and Honor smartphone motherboards.
- Compatibility: Engineered for MSM8916, 8939, and MT6753V processors.
- Compatible Devices:
- Huawei G7
- Huawei G8X
- Huawei 5S
- Honor 7
- Honor 5X (Kiwi)
- Key Features: Durable steel construction, ensures accurate solder paste application and perfect IC alignment.
