Sale!

BZ03 MSM8916/8939/MT6753V CPU HUAWEI G7-8

Original price was: ₨ 1,200.Current price is: ₨ 800.

BZ03 MSM8916/8939/MT6753V CPU HUAWEI G7-8

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Description

The BZ03 MSM8916 Stencil is a professional BGA reballing Stencil

  • Product Type: BGA IC reballing Android Stencil
  • Description: A professional BGA reballing tool designed for high-precision repairs on Huawei and Honor smartphone motherboards.
  • Compatibility: Engineered for MSM8916, 8939, and MT6753V processors.
  • Compatible Devices:
    • Huawei G7
    • Huawei G8X
    • Huawei 5S
    • Honor 7
    • Honor 5X (Kiwi)
  • Key Features: Durable steel construction, ensures accurate solder paste application and perfect IC alignment.

Additional information

Weight0.1 kg