Description
The QL02 MSM8976 8956 CPU Stencil is a professional-grade BGA reballing Stencil
- Product Type: BGA IC reballing Android Stencil
- Description: A professional-grade BGA reballing tool designed for high-precision mobile repairs. It is specifically engineered for MSM8976 and MSM8956 processors.
- Compatibility:
- Devices: Oppo R9P, R9SP, Vivo X6, X7, X9S, and Xiaomi Mi Max.
- Key Features: Durable steel construction, ensures accurate solder paste application and perfect IC alignment. Essential for technicians performing advanced CPU reballing and motherboard maintenance.
