Description
The QL-01 SDM 660 CPU Stencil is a professional-grade BGA reballing Stencil
- Product Type: BGA IC reballing Android Stencil
- Description: A professional-grade BGA reballing tool designed for high-precision mobile repairs. This durable steel stencil is specifically engineered for the SDM 660 processor.
- Compatibility:
- Devices: Oppo R11 series, Vivo X20, and Xiaomi Mi Note 3.
- Key Features: Durable steel construction, ensures accurate solder paste application and perfect IC alignment. Essential for technicians performing advanced CPU reballing and motherboard maintenance.
