Description
The BZ07 Kirin 960 CPU Stencil is a high-precision BGA reballing Stencil
- Product Type: BGA IC reballing Android Stencil
- Description: A high-precision BGA reballing tool designed for professional Huawei mobile motherboard repairs.
- Compatibility: Engineered specifically for Kirin 960 (Hi3660) processors.
- Compatible Devices:
- Huawei P10
- Huawei Mate 9 / Mate 9 Pro
- Huawei nova 2S
- Honor 9 / Honor V9 series
- Key Features: Durable steel construction ensures accurate solder paste application and perfect IC alignment. Essential for advanced CPU reballing and chip-level maintenance.
