BZ07 Kirin960 Hi3660 CPU HUAWEI P & Mate Series

Name: World Gsm Telecom
Price range: $$$

Original price was: ₨ 1,200.Current price is: ₨ 800.

shop now at World Gsm Telecom

Description

The BZ07 Kirin 960 CPU Stencil is a high-precision BGA reballing Stencil

Product Type: BGA IC reballing Android Stencil
Description: A high-precision BGA reballing tool designed for professional Huawei mobile motherboard repairs.
Compatibility: Engineered specifically for Kirin 960 (Hi3660) processors.
Compatible Devices:
- Huawei P10
- Huawei Mate 9 / Mate 9 Pro
- Huawei nova 2S
- Honor 9 / Honor V9 series
Key Features: Durable steel construction ensures accurate solder paste application and perfect IC alignment. Essential for advanced CPU reballing and chip-level maintenance.