Description
The BZ07 Kirin 960 CPU Stencil is a high-precision BGA reballing tool specifically designed for professional Huawei mobile motherboard repairs. This durable steel stencil is engineered for Kirin 960 (Hi3660) processors, ensuring accurate solder paste application and perfect IC alignment. It is compatible with the Huawei P10, Mate 9, Mate 9 Pro, nova 2S, Honor 9, and Honor V9 series. An essential tool for technicians performing advanced CPU reballing and chip-level maintenance.
Focus Keyphrase: BZ07 Kirin 960 Stencil
