Description
The BZ08 Kirin 970 CPU Stencil is a professional BGA reballing Stencil
- Product Type: BGA IC reballing Android Stencil
- Description: A professional BGA reballing tool designed for high-precision Huawei motherboard repairs.
- Compatibility: Engineered for Kirin 970 (Hi3670) processors.
- Compatible Devices:
- Huawei P20 / P20 Pro
- Huawei Mate 10 / Mate 10 Pro / Mate 10 RS
- Honor 10 / Honor V10 series
- Key Features: Durable steel construction ensures accurate solder paste application and perfect alignment. Essential for advanced IC reballing and chip-level maintenance.
