Sale!

BZ 08 Kirin970 Hi3670 CPU HUAWEI P & Mate Series

Original price was: ₨ 1,200.Current price is: ₨ 800.

BZ 08 Kirin970 Hi3670 CPU HUAWEI P & Mate Series

shop now at World Gsm Telecom

Description

The BZ08 Kirin 970 CPU Stencil is a professional BGA reballing Stencil

  • Product Type: BGA IC reballing Android Stencil
  • Description: A professional BGA reballing tool designed for high-precision Huawei motherboard repairs.
  • Compatibility: Engineered for Kirin 970 (Hi3670) processors.
  • Compatible Devices:
    • Huawei P20 / P20 Pro
    • Huawei Mate 10 / Mate 10 Pro / Mate 10 RS
    • Honor 10 / Honor V10 series
  • Key Features: Durable steel construction ensures accurate solder paste application and perfect alignment. Essential for advanced IC reballing and chip-level maintenance.

Additional information

Weight0.1 kg