BZ05 HI6620/6250/MSM8952 CPU HUAWEI P8/P9

Name: World Gsm Telecom
Price range: $$$

Original price was: ₨ 1,200.Current price is: ₨ 800.

shop now at World Gsm Telecom

Description

The BZ05 Huawei CPU Stencil is a professional-grade BGA reballing Stencil

Product Type: BGA IC reballing Android Stencil
Description: A professional-grade BGA reballing tool designed for high-precision motherboard repairs on Huawei and Honor smartphones.
Compatibility: Engineered for HI6620, 6250, and MSM8952 processors.
Compatible Devices:
- Huawei P8
- Huawei P9 Lite (Dual 4G)
- Honor 4X, 4C, 5C, and 5A series
Key Features: Durable steel construction, ensures accurate solder paste application and perfect alignment. Essential for advanced IC reballing and chip-level maintenance.