Description
The BZ05 Huawei CPU Stencil is a professional-grade BGA reballing Stencil
- Product Type: BGA IC reballing Android Stencil
- Description: A professional-grade BGA reballing tool designed for high-precision motherboard repairs on Huawei and Honor smartphones.
- Compatibility: Engineered for HI6620, 6250, and MSM8952 processors.
- Compatible Devices:
- Huawei P8
- Huawei P9 Lite (Dual 4G)
- Honor 4X, 4C, 5C, and 5A series
- Key Features: Durable steel construction, ensures accurate solder paste application and perfect alignment. Essential for advanced IC reballing and chip-level maintenance.
