Description
The QL06 Kirin 970 HI3670 CPU Stencil is a high-precision BGA reballing tool designed for professional mobile motherboard repairs. This durable steel stencil is specifically engineered for the Kirin 970 (HI3670) processor, ensuring accurate solder paste application and perfect alignment. It is compatible with premium Huawei and Honor devices, including the Huawei P20, P20 Pro, Mate 10, Mate 10 Pro, RS, Honor 10, and V10. An essential tool for technicians performing advanced CPU reballing and IC maintenance.
Focus Keyphrase: QL06 Kirin 970 HI3670 CPU Stencil
