Description
The BZ04 Kirin 950/955 CPU Stencil is a professional-grade BGA reballing Stencil
- Product Type:Â BGA IC reballing Android Stencil
- Description:Â A professional-grade BGA reballing tool designed for high-precision motherboard repairs on Huawei and Honor smartphones.
- Compatibility: Engineered specifically for Kirin 950 and Kirin 955 (HI3650) processors.
- Compatible Devices:
- Huawei P9
- Huawei Mate 8
- Honor 8
- Honor V8
- Honor Magic
- Key Features:Â Durable steel construction ensures accurate solder paste application and perfect alignment. Essential for technicians performing advanced IC reballing and chip-level maintenance.
