Description
The BZ01 Kirin Hi Series Stencil by Mega Idea is a professional-grade BGA reballing Stencil
- Product Type: BGA IC reballing Android Stencil
- Description: A professional-grade BGA reballing tool by Mega Idea, specifically designed for precision motherboard repairs on Huawei devices.
- Compatibility: Engineered for the Kirin Hi Series, providing perfect alignment for:
- IF Chips
- WIFI Chips
- Audio Chips
- Key Features:
- High-Quality Steel: Ensures durability and accurate solder paste application.
- Precision: Essential for advanced chip-level maintenance and IC reballing
