Description
The BZ02 Kirin 930 Stencil is a professional BGA reballing tool designed for high-precision motherboard repairs on Huawei and Honor smartphones. This durable steel stencil is engineered for the Kirin 930 and Kirin 935 (Hi3630/3635) CPU series, ensuring accurate solder paste application and perfect IC alignment. It is compatible with the Huawei P8, Mate 7, Honor 7, and Honor X2 series. An essential tool for technicians performing advanced chip-level maintenance and CPU reballing.
Focus Keyphrase: BZ02 Kirin 930 Stencil
