Description
The QianLi 3D Stencil Kirin 655,659 is a high-precision BGA reballing Stencil
- Product Type: BGA IC reballing Android Stencil
- Description: A high-precision BGA reballing tool designed for professional motherboard repairs. It features QianLi’s signature 3D design for superior alignment.
- Compatibility: Specifically engineered for Kirin 655 and Kirin 659 CPUs.
- Key Features:
- 3D Design: Securely fits over the IC to prevent shifting during soldering.
- Durability: Made from durable, heat-resistant steel.
- Precision: Ensures accurate solder ball placement for reliable maintenance.
