Description
The BZ04 Kirin 950/955 CPU Stencil is a professional-grade BGA reballing tool designed for high-precision motherboard repairs on Huawei and Honor smartphones. This durable steel stencil is engineered specifically for Kirin 950 and Kirin 955 (HI3650) processors, ensuring accurate solder paste application and perfect alignment. It is compatible with the Huawei P9, Mate 8, Honor 8, Honor V8, and Honor Magic. An essential tool for technicians performing advanced IC reballing and chip-level maintenance.
Focus Keyphrase: BZ04 Kirin 950 Stencil
