Description
The BZ02 Kirin 930 Stencil is a professional BGA reballing Stencil
- Product Type: BGA IC reballing Android Stencil
- Description: A professional BGA reballing tool designed for high-precision motherboard repairs on Huawei and Honor smartphones.
- Compatibility: Engineered for the Kirin 930 and Kirin 935 (Hi3630/3635) CPU series.
- Compatible Devices:
- Huawei P8
- Huawei Mate 7
- Honor 7
- Honor X2
- Key Features: Durable steel construction, ensures accurate solder paste application and perfect IC alignment. Essential for technicians performing advanced chip-level maintenance and CPU reballing.
