Relife Universal BGA Stencil 0.3/0.35/0.4/0.5mm Parallel

Relife Universal BGA Stencil 0.3.0.35.0.40.5Parallel

₨ 1,000

 Relife Universal BGA Stencil 0.3/0.35/0.4/0.5mm Parallel

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Description

 Relife Universal BGA Stencil 0.3/0.35/0.4/0.5mm Parallel

  • Status: Published (In Stock)
  • Category: BGA IC reballing Android Stencils
  • Product Link: View Product on Shop

**Technical Specifications**

  • Hole Sizes: 0.3mm, 0.35mm, 0.4mm, and 0.5mm
  • Design: Features both Parallel and 45-degree hole designs
  • Purpose: Multi-purpose reballing tool for professional mobile IC repair
  • Weight: 0.2 kg

**Key Features**

  • Versatile Range: Supports a wide variety of BGA chips with its multiple hole sizes.
  • Precision Planting: High-quality solder net ensures accurate tin planting and reliable soldering.
  • Technician Essential: A high-quality tool designed for durability and precision in professional repair environments.

Additional information

Weight0.2 kg

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