RELIFE RL-044 MQ3 Qualcomm MTK-CPU Stencil

 800

Description

The RELIFE RL-044 MQ3 CPU Stencil is a professional-grade reballing tool designed for high-precision maintenance of Qualcomm and MTK CPUs. It features a precise 0.12mm thickness. Additionally, it supports a wide range of mobile processors including SM7250, SM8250, and MT6885Z. This ensures stable and accurate tin planting.

Focus Keyphrase: RELIFE RL-044 MQ3 CPU Stencil

Additional information

Weight.2 kg