Description
RELIFE RL-044 MQ4 Qualcomm MTK CPU Stencil
The RELIFE CPU Stencil is a professional-grade planting tin steel stencil designed for high-precision mobile phone reballing. With a precise 0.12mm thickness, it offers exceptional accuracy for Qualcomm and MTK CPUs, including Snapdragon 888, 778G, and MT6833V.
