Description
The QL25 MSM8996 CPU Stencil is a professional-grade BGA reballing tool specifically engineered for the Samsung Galaxy S7 series. This high-precision stencil provides perfect alignment for the MSM8996 CPU, ensuring accurate solder paste application and reliable IC soldering. Compatible with Samsung models G9300, G9350, and G9308, it is an essential component for technicians performing advanced board-level repairs on S7 series devices.
Focus Keyphrase: QL25 MSM8996 CPU Stencil
