Home / Mobile Phone Repair Tools buy Online Now / BGA IC Reballing Stencils / Mijing M22 Pro 4-in-1 Double-sided Magnetic Heat-resistant Silicone PadMijing GK18/19 Universal Toughened Insulated Glass Phone PCB Fixture Mijing HC-03 0.3MM 50g 183C High Purity Residue Free Solder WireMijing M22 Pro 4-in-1 Double-sided Magnetic Heat-resistant Silicone Pad₨ 1,700Mijing M22 Pro 4-in-1 Double-sided Magnetic Heat-resistant Silicone Padshop now at World Gsm Telecom - Mijing M22 Pro 4-in-1 Double-sided Magnetic Heat-resistant Silicone Pad quantity + Add to cart Category: BGA IC Reballing Stencils Tweet This Product Share on Facebook Pin This Product Description Additional information DescriptionMijing M22 Pro 4-in-1 Double-sided Magnetic Heat-resistant Silicone PadKey Features:Multifunctional Design: A professional-grade 4-in-1 tool featuring four different depths for various repair tasks.Magnetic Adsorption: Strong magnetic properties to keep small components and tools securely in place during IC maintenance and tin planting.Heat Resistant: Built to withstand high temperatures, making it ideal for precision soldering and mobile phone repairs.Double-sided: Offers versatility with a functional design on both sides.You can view the product and purchase it here: Mijing M22 Pro Silicone Pad Additional informationWeight.2 kgRelated productsQL04 MSM8916 8939 8940 CPU BGA Stencil for Oppo & Vivo Series ₨ 1,200 Original price was: ₨ 1,200.₨ 800Current price is: ₨ 800.QL04 MSM8916 8939 8940 CPU BGA Stencil for Oppo & Vivo Seriesshop now at World Gsm Telecom - QL04 MSM8916 8939 8940 CPU BGA Stencil for Oppo & Vivo Series quantity + Add to cart Sale!QL04 MSM8916 8939 8940 CPU BGA Stencil for Oppo & Vivo SeriesBGA IC Reballing Stencils ₨ 1,200 Original price was: ₨ 1,200.₨ 800Current price is: ₨ 800. Add to cart Quick View Buy via WhatsApp BZ 08 Kirin970 Hi3670 CPU HUAWEI P & Mate Series ₨ 1,200 Original price was: ₨ 1,200.₨ 800Current price is: ₨ 800.BZ 08 Kirin970 Hi3670 CPU HUAWEI P & Mate Seriesshop now at World Gsm Telecom - BZ 08 Kirin970 Hi3670 CPU HUAWEI P & Mate Series quantity + Add to cart Sale!BZ 08 Kirin970 Hi3670 CPU HUAWEI P & Mate SeriesBGA IC Reballing Stencils ₨ 1,200 Original price was: ₨ 1,200.₨ 800Current price is: ₨ 800. Add to cart Quick View Buy via WhatsApp BZ 06 Kirin 910T HI6620 CPU for HUAWEI P7 Series ₨ 1,200 Original price was: ₨ 1,200.₨ 800Current price is: ₨ 800.BZ 06 Kirin 910T HI6620 CPU for HUAWEI P7 Seriesshop now at World Gsm Telecom - BZ 06 Kirin 910T HI6620 CPU for HUAWEI P7 Series quantity + Add to cart Sale!BZ 06 Kirin 910T HI6620 CPU for HUAWEI P7 SeriesBGA IC Reballing Stencils ₨ 1,200 Original price was: ₨ 1,200.₨ 800Current price is: ₨ 800. Add to cart Quick View Buy via WhatsApp BZ 23 Qualcomm Snapdragon Exynos9810 S9/S9+ ₨ 1,200 Original price was: ₨ 1,200.₨ 800Current price is: ₨ 800.BZ 23 Qualcomm Snapdragon Exynos9810 S9/S9+shop now at World Gsm Telecom - BZ 23 Qualcomm Snapdragon Exynos9810 S9/S9+ quantity + Add to cart Sale!BZ 23 Qualcomm Snapdragon Exynos9810 S9/S9+BGA IC Reballing Stencils ₨ 1,200 Original price was: ₨ 1,200.₨ 800Current price is: ₨ 800. Add to cart Quick View Buy via WhatsApp