Description
RELIFE RL-044 IPZ8 IP13/13Pro/13ProMax/13Mini-A15 Stencil:
**Product Overview**
The RELIFE RL-044 IPZ8 is a high-quality CPU universal plant tin steel stencil specifically designed for the iPhone 13 series. It is a essential tool for professional technicians performing A15 Bionic CPU reballing and motherboard repairs.
**Key Specifications**
- Model:Â RELIFE RL-044 IPZ8
- Compatibility:Â iPhone 13, 13 Pro, 13 Pro Max, and 13 Mini
- Chipset Support:Â A15 Bionic CPU
- Thickness:Â 0.12mm (Ultra-thin for precision)
- Category:Â iPhone BGA Middle Layers Stencils
- Price: ₨ 1,000
- Weight:Â 0.2 kg
- Stock Status:Â In Stock
**Core Features**
- Universal Design:Â Covers the entire iPhone 13 lineup for A15 CPU reballing.
- Precision Engineering:Â 0.12mm thickness ensures accurate solder paste application and perfect solder ball formation.
- Durable Material:Â Made from high-quality steel to resist heat and prevent deformation during high-temperature soldering.
