Description
RELIFE RL-044 IPZ1 IP6/6P-A8 CPU Integrated Steel Stencil
**Key Specifications**
- Model: RELIFE RL-044 IPZ1
- Compatibility: iPhone 6 and iPhone 6 Plus
- Chipset Support: A8 Bionic CPU
- Thickness: 0.12mm (Optimized for precision reballing)
- Category: iPhone BGA Middle Layers Stencils
**Core Features**
- Integrated Design: Specifically tailored for the A8 CPU architecture to ensure perfect alignment.
- Precision Thickness: The 0.12mm steel mesh provides the ideal balance for solder paste application, preventing bridging or insufficient solder.
- High-Quality Steel: Built to withstand high temperatures during the soldering process without warping or losing its shape.
