Description
The Mijing 3D A9 Stencil is a premium, high-temperature resistant alloy steel template designed for reballing the Apple A9 CPU in the iPhone 6S and 6S Plus. It features stepped grooves for rapid IC alignment and square holes to easily remove formed solder balls
Key Features
- Design: 3D stepped groove technology ensures the stencil accurately snaps into place over the IC.
- Efficiency: Features square holes for easy solder ball separation and higher reballing success rates.
- Durability: Thicker than standard stencils, highly resistant to deformation, and built to withstand prolonged heat.
