Description
The Mijing 3D A9 Stencil is a premium, high-temperature resistant alloy steel template designed for reballing the Apple A9 CPU in the iPhone 6S and 6S Plus . It features stepped grooves for rapid IC alignment and square holes to easily remove formed solder balls
Key Features
- Design: 3D stepped groove technology ensures the stencil accurately snaps into place over the IC.
- Efficiency: Features square holes for easy solder ball separation and higher reballing success rates.
- Durability: Thicker than standard stencils, highly resistant to deformation, and built to withstand prolonged heat.
