Description
The Mijing iPH-5 CPU Stencil is a high-precision BGA reballing tool specifically designed for iPhone repair. It typically supports a range of Apple CPUs, including the A8, A9, A10, and A11 chips.
Key features of this series include:
- High-Temperature Resistance:Â Made from high-quality stainless steel that resists warping during heat gun application.
- Precision Hole Alignment:Â CNC-machined square holes ensure accurate solder paste application for BGA pins.
- Anti-Bulge Design:Â Specifically engineered to stay flat under heat, preventing solder bridges.
