Description
Relife BGA Stencil for IP14/14Plus/14Pro/14Pro Max (A15/A16):
**Product Overview**
The Relife RL-044 is a high-precision CPU BGA reballing stencil specifically designed for the iPhone 14 series. It is engineered for professional technicians performing motherboard repairs, specifically targeting the A15 and A16 Bionic chips.
**Key Specifications**
- Model: Relife RL-044
- Compatibility: iPhone 14, 14 Plus, 14 Pro, and 14 Pro Max
- Chipset Support: A15 and A16 Bionic CPUs
- Category: iPhone BGA Middle Layers Stencils
- Price: ₨ 1,000
- Weight: 0.2 kg
- Stock Status: In Stock
**Core Features**
- High Precision: Accurate hole positioning for perfect solder ball alignment.
- Heat Resistance: Durable material designed to withstand high temperatures during the reballing process without warping.
- Professional Grade: Optimized for middle-layer and CPU repair tasks.
