QianLi 3D MTK 6582 Professional Grade BGA Reballing

 1,800

QianLi 3D MTK 6582 Professional Grade BGA Reballing

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Description

QianLi 3D MTK 6582 Professional Grade BGA Reballing

 

  • Product Type: BGA IC reballing Android Stencil
  • Description: A professional solution engineered for high-precision mobile phone motherboard repairs. It features QianLi’s innovative 3D design for a secure fit over the IC.
  • Compatibility: Specifically optimized for the MTK 6582 CPU.
  • Key Features:
    • 3D Design: Ensures perfect solder ball alignment and prevents shifting.
    • Durability: Made from durable, heat-resistant steel mesh.
    • Precision: Engineered for advanced chip-level maintenance.

Additional information

Weight0.1 kg