RELIFE RL-044 MQ2 Qualcomm MTK CPU tin Steel stencil

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Description

RELIFE RL-044 MQ2 Qualcomm/MTK CPU planting tin steel stencil / thickness 0.12MM

MQ:2 CPU BGA Reballing Stencil Net for Qualcomm MTK MT6779V / 6768 / 6765 / SDM439 / MSM8909W

Additional information

Weight.2 kg