Description
The RELIFE RL-044 MQ2 CPU Stencil is a professional BGA reballing tool designed for high-precision maintenance of Qualcomm and MTK processors. With a precise 0.12mm thickness, it supports a wide range of mobile CPUs including MT6779V, MT6768, MT6765, SDM439, and MSM8909W, ensuring stable and accurate tin planting for professional repairs.
Focus Keyphrase: RELIFE RL-044 MQ2 CPU Stencil
