Description
QL 22 Qualcom CPU MSM8998 AB MSM8953 1AB B01
The QL22 Qualcomm CPU Stencil is a professional-grade BGA reballing tool designed for high-precision mobile motherboard repairs. For example, it fits the MSM8998, MSM8953, MSM8916, and MSM8937 series. It ensures perfect alignment and accurate solder paste application.