Description
The QL09 MSM8916 8928 MT6952 CPU Stencil is a high-precision BGA reballing tool engineered for professional mobile motherboard repairs. This durable steel stencil is specifically designed for Qualcomm and MediaTek processors used in the Redmi Note and Redmi 2/2A series. As a result, it ensures accurate solder paste application and perfect alignment. Therefore, it is an essential tool for technicians performing advanced CPU reballing and maintenance on Xiaomi devices.
