Description
Relife TF1 Mini Tetris-Type Heat-Insulating Glass Chip Repair Fixture
**Product Overview**
The Relife TF1 Mini is a creative and highly functional repair fixture that integrates a “Tetris-type” design. It is small, portable, and specifically engineered for precise clamping of mobile phone chip ICs and motherboards.
**Key Features**
- High-Temperature Resistance: Features a tempered glass panel that can withstand temperatures of 500℃+ without deformation.
- Tetris-Type Design: Combines creativity and nostalgia into a functional tool for a unique repair experience.
- Precise Clamping: Uses an inward bevel design to ensure a firm grip. The motherboard is suspended in the air to prevent heat loss through conduction, allowing for quicker desoldering.
- Broad Compatibility: Supports two-way movement for motherboard repair, chip degumming, and clamping of CPUs, hard disks, and other ICs.
- Easy Maintenance: The glass panel is resistant to corrosion and can be cleaned with a simple wipe.
- Smooth Operation: Features a knob clamping mechanism with a slider that moves smoothly without sticking.
- Category: PCB Fixtures
**Package Includes**
- 1 x Relife TF1 Mini Fixture
