Relife TF2 Plus Heat-Insulating Glass PCB Repair Fixture

**Product Overview**

The Relife TF1 Mini is a creative and highly functional repair fixture that integrates a “Tetris-type” design. It is small, portable, and specifically engineered for precise clamping of mobile phone chip ICs and motherboards.

**Key Features**

• High-Temperature Resistance: Features a tempered glass panel that can withstand temperatures of 500℃+ without deformation.
• Tetris-Type Design: Combines creativity and nostalgia into a functional tool for a unique repair experience.
• Precise Clamping: Uses an inward bevel design to ensure a firm grip. The motherboard is suspended in the air to prevent heat loss through conduction, allowing for quicker desoldering.
• Broad Compatibility: Supports two-way movement for motherboard repair, chip degumming, and clamping of CPUs, hard disks, and other ICs.
• Easy Maintenance: The glass panel is resistant to corrosion and can be cleaned with a simple wipe.
• Smooth Operation: Features a knob clamping mechanism with a slider that moves smoothly without sticking.

**Package Includes**

• 1 x Relife TF1 Mini Fixture

**Product Link**

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