Description
JTX T4 Pro Universal Chips Glue Removal Support upto 85 Chip Android and IPhone
JTX T4 Pro Universal Chips Glue Removal and Tin Planting Platform Set for iPhone / Samsung / Hisilicon / Android RAM
Features:
T4 Pro degumming and tin planting platform, support Apple/Huawei/OPPO/VIVO/Honor/Xiaomi/Samsung and other models a total of 84 models of chips
The 2-in-1 design greatly helps the maintenance master to save costs and plant tin efficiency
Magnetic automatic clamping, universal 3D planting tin net, removing the glue card, precise positioning
Clamping precision, more stable operation, not easy to damage the chip
Using a new type of magnetic dynamic positioning, strong magnetic clamping stable, automatic alignment
It has wear-resistant, anti-slip, shock-absorbing, anti-aging, non-toxic tasteless, and high-temperature resistance
Selected high-quality steel, fine workmanship, wear resistance, high toughness support tin planting
Support unlimited expansion, a total of 76 types of chips
Supported models are as follows:
Qualcomm: MSM8909/8905, MSM8916/8939, MSM8917, MSM8953, MSM8953 1AB, MSM8937/8940, MSM8996, SM8150, SM8250, SM8250-002, SM8350, SM8450, SM8475, SM8550, SM8650, SM6115, SM7225-00AB, SM7250, SM7325, SM7350, SDM439, SDM636, SDM710, SDM845, SM665, SM6150, SM8750, SM730G, SM7150,SM680, SM6225, SM7475, SM6450, SM720, SM7125
Dimensity: MT6761V/6762V/6765V, MT6885Z, MT6895Z, MT6893Z, MT6855V, MT6853V, MT6877V, MT6769V, MT6873V, MT6833V, 1100/1200, 9200, 9300
Android RAM: BGA 376, BGA 436, BGA 496, BGA 556
Samsung Exynos: 990, 8895, 980, 2100, 2200, 9820
Huawei Hisilicon: HI3660, HI9290/L, HI6280, HI3690 5G, HI3680, HI36A0, HI3670, HI36A0, HI6260, HI3690 4G
Apple: A8, A9, A10, A11, A12, A13, A14, A15, A16, A17, A18, A18 Pro
Package includes:
1 x Fixture
14 x Stencil
