Description
The JTX Universal UV Stencil is a precision tool used for repairing damaged solder masks and pad traces on mobile phone motherboards and IC chips. It features multi-pitch hole spacings (0.3, 0.35, 0.4, and 0.5 mm) designed for applying UV-curable solder mask green oil.
Key Features and Specifications
- Hole Pitches: Universal spacing options including 0.3mm, 0.35mm, 0.4mm, and 0.5mm to match various BGA pad layouts.
- Application: Used with UV green oil to rebuild missing or scratched solder mask insulation on peeled PCB tracks.
- Compatibility: Covers general universal layouts alongside specific series for iPhone, Qualcomm, MediaTek (MTK), Samsung, and HiSilicon chips.
- Material: Durable high-precision template material engineered to resist wear and allow clean separation from cured resin.
- Clean the damaged area on the chip or motherboard and dry it completely.
- Apply a thin, even layer of UV green solder mask oil across the repair zone.
- Cure the oil using a purple/UV light lamp for 6 to 15 seconds.
- Peel off the stencil, clean the area with alcohol or PCB cleaner, and finish with a secondary UV cure.
