Description
The RELIFE RL-039 is a specialized 20ml liquid adhesive remover, silicone sealants, and black resin glues from mobile phone motherboards and BGA IC chips.
How to Use RELIFE RL-039
Proper application ensures you can safely remove electronic glues without damaging the fragile circuit boards or copper wiring beneath.
- Prepare: Shake the bottle well before use. Since there may be air pressure in the bottle, carefully open the cap.
- Apply: Extract a proper amount of the liquid using a pipette or fine dropper and drip it directly onto the glue or resin you need to remove.
- Wait: Leave the motherboard and BGA IC chip sitting horizontally for 5 to 10 minutes to allow the chemical to fully soften the cured glue.
- Scrape/Peel: Use a special, precision repair tool (like a BGA blade) to carefully peel and scrape away the softened adhesive. Take extreme caution to avoid damaging wiring or copper foil on the mainboard.
- Clean: Once the glue is removed, wipe or wash off any residual adhesive and liquid solution from the chip and mainboard.
- Chemical Profile: The solution is weakly acidic and eco-friendly, but it should still be handled only by trained professionals.
- Skin & Eyes: Avoid getting the liquid on your skin or in your eyes. If contact occurs, rinse immediately and thoroughly with clean water.
- Storage: Store the bottle in a cool, well-ventilated location, away from direct sunlight, and always keep out of reach of children.
