Description
Relife RL-601MA iPhone CPU Lower Layer Tin Planting Platform Set for iPhone 6 to 15Pro Max A8 to A17
Features:
iPhone CPU tin planting platform set suitable for A8/A9/A10/A11/A12/A13/A14/A15/A16/A17 CPU
Automatic and precise alignment / Universal chip slot structure / Integration of positioning / Glue removal / Tin planting
Precise positioning / Fast tin planting / Strong magnetic adsorption / Automatic clamping
Using a new type of magnetic power original positioning, strong magnetic automatic clamping, convenient and flexible, support for a variety of CPU maintenance positioning, stable and reliable clamping
Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetic unchanged
General more IC clamps such as chip CPU/hard disk/font library; place the chip fixedly in the upper left corner of the chip slot (let the magnetic suction module automatically withstand the edge of the chip, which can cover the corresponding chip tin-planting steel stencil
High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls
Anti-drum, so that each solder ball is round and full, to meet the needs of various chips
High quality environmentally friendly stone, high strength, anti-dirt, easy to clean
Wear-resistant and anti-skid, shock absorption and compression resistance, anti-aging
Package includes:
1 x Fixture
10 x Steel mesh
