BZ 23 Qualcomm Snapdragon Exynos9810 S9/S9+

Name: World Gsm Telecom
Price range: $$$

Original price was: ₨ 1,200.Current price is: ₨ 800.

shop now at World Gsm Telecom

Description

Product Type: BGA IC reballing Android Stencil
Description: A professional-grade BGA reballing tool designed for high-precision mobile repairs. It is specifically engineered for Qualcomm Snapdragon 845 and Samsung Exynos 9810 processors.
Compatibility:
- Devices: Samsung Galaxy S9 and S9+ series.
Key Features: Durable steel construction, ensures accurate solder paste application and perfect IC alignment. Essential for technicians performing advanced CPU reballing and motherboard maintenance.