Description
2UUL-BH17-CPU-REBALL-BASE-Magnetic-Dual-Sided-Reballing-Platform-Set is a high-precision fixture designed for professional BGA reballing of mobile phone CPUs. It features a unique dual-sided magnetic base that allows for quick switching between different chip types and thicknesses without changing tools
- Dual-Sided/Dual-Thickness Design: The platform supports two different thickness specifications: T0.6 (optimized for Apple CPUs) and T0.35 (optimized for Android CPUs).
2UUL-BH17-CPU-REBALL-BASE-Magnetic-Dual-Sided-Reballing-Platform-Set
CPU stencil models (75pcs):
1. For iPhone 7-17 Pro Max (12pcs):
– A19 Pro
– A19
– A18 Pro
– A18
– A17
– A16
– A15
– A14
– A13
– A12
– A11
– A10
2. Qualcomm series (17pcs):
– SM8750
– SM8450
– SM8150
– SM7325
– SM7125
– SM8650
– SM8350
– SM7550
– SM7250
– SM8550
– SM7150
– SM7450
– SM8475/SM7475
– SM8250-102
– SM7350
– SM8250-002
– SM7225-00AB
3. Hi Silicon series (9pcs):
– Hi36C0
– Hi36A0
– Hi3690-5G
– Hi3690-4G
– Hi3680
– Hi6280
– Hi6290/L
– Hi3640
– Hi3670
4. Exynos series (11pcs):
– Exynos 2200
– Exynos 2100
– Exynos 9820
– Exynos 980
– Exynos 8895
– Exynos 1480-E8845
– Exynos 1330-E8535P
– Exynos 990
– Exynos 1380-E8835P
– Exynos 1280-E8825
– Exynos 9815/1080
5. MTK series (14pcs):
– MT6989W
– MT6985W
– MT6895Z
– MT6897Z
– MT6855V
– MT6877V
– MT6853V
– MT8781/MT6789V
– MT6983Z
– MT6761V/6762V/6765
– MT6885Z
– MT6833V
– MT6873V/6875V
– MT6891Z/6893Z
6. EMMC+RAM series (12pcs):
– BGA 254
– BGA 186
– BGA 169
– BGA 162
– BGA 134
– BGA 556
– BGA 436
– BGA 376
– BGA 178
– BGA 496
– BGA 153
– BGA 221
Package includes:
